Qualcomm Opens Its First Joint Innovation Center in China for Smart Connected Vehicles
Fan Xuehan
DATE:  May 26 2023
/ SOURCE:  Yicai
Qualcomm Opens Its First Joint Innovation Center in China for Smart Connected Vehicles Qualcomm Opens Its First Joint Innovation Center in China for Smart Connected Vehicles

(Yicai Global) May 26 -- Qualcomm opened its first innovation hub for intelligent connected vehicles in China yesterday, the US chip giant’s sixth innovation center co-built with a Chinese partner.

The internet of vehicles technical innovation center was set up by Qualcomm and Thunder Software Technology, an operating systems provider, in Suzhou in China’s eastern Jiangsu province.

The center will provide technical services for the development of smart connected vehicles, including research and development, application scenarios, roadside facility development, and ecosystem partners integration, Qualcomm China Chairman Frank Meng said at the opening ceremony.

With the development of intelligent connected vehicle technology, Qualcomm put forward the concept of digital chassis technology, which includes communication connectivity, smart cockpit, assisted and autonomous driving, and cloud-vehicle collaboration technologies, Meng noted, adding that it is also in line with the firm's development goals in the auto chip market.

Beijing-based Thunder Software will supply the operating system for intelligent connected vehicles and software support for the project, Chairman and Chief Executive Officer Zhao Hongfei said.

"Chips, communication, and OS are the three biggest ecological elements of IOV," Zhao added. "Only through optimizing software, toolchain, and OS can chip capabilities be maximized.

“Full cooperation between OS developers and chipmakers can lower IOV's threshold across the industry," Zhao noted.

On May 18, Intel, another US chipmaker, unveiled two smart connected vehicle demonstration jointly developed with Chinese computer maker Lenovo in Chongqing. Intel provides hardware products and software development kits, while Lenovo is responsible for smart transport and IOV solutions.

Editors: Tang Shihua, Futura Costaglione

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Keywords:   Joint Innovation Center,R&D,IToV,Qualcomm,Thunder Soft